MULTILAYER CERAMICS MANUFACTURING

被引：12

作者：

BURGER, WG

WEIGEL, CW

机构：

来源：

IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1983年 / 27卷 / 01期

关键词：

D O I：

10.1147/rd.271.0011

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

收藏

页码：11 / 19

页数：9

相关论文

共 5 条

[1] THERMAL CONDUCTION MODULE - A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGE
BLODGETT, AJ
BARBOUR, DR
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) : 30 - 36
[2] A MULTILAYER CERAMIC MULTICHIP MODULE
BLODGETT, AJ
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (04): : 634 - 637
[3] HALL A, 1982, 32ND P EL COMP C WAS, P518
[4] PLANT AUTOMATION IN A STRUCTURED DISTRIBUTED SYSTEM ENVIRONMENT
MESCIA, NC
WOODS, CD
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (04) : 497 - 505
[5] PRECISE NUMERICAL CONTROL FOR THE THERMAL CONDUCTION MODULE
SANBORN, MA
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1983, 27 (01) : 20 - 26