ELECTRICAL-PROPERTIES OF MULTILAYER-CHIP ZNO VARISTORS IN A MOIST-AIR ENVIRONMENT

被引:23
作者
YEN, AJ
LEE, YS
TSENG, TY
机构
[1] NATL CHIAO TUNG UNIV,DEPT ELECTR ENGN,HSINCHU,TAIWAN
[2] NATL CHIAO TUNG UNIV,INST ELECTR,HSINCHU,TAIWAN
关键词
D O I
10.1111/j.1151-2916.1994.tb04537.x
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Multilayer-chip varistors mere prepared using the ZnO-glass system by applying tape casting technology. The effect of processing conditions on the multilayer ceramic microstructure and electrical properties mas studied. The location, size, and density of the pores within the multilayer structure were examined by scanning electron microscopy and the displacement method using distilled mater. The experimental results showed that the electrical properties of a multilayer-chip varistor could be influenced substantially by the porosities associated with environmental moisture in the range approximate to 15%-95% relative humidity at 25 degrees C. Such an effect can cause substantial current leakage as well as the separation of the I-V curves into four regions, i.e., prebreakdown, linear, breakdown, and upturn. A proposed pore model and equivalent circuit for the multilayer-chip ZnO varistors have been simulated with a commercial varistor and a serial resistance to demonstrate the observed I-V phenomena.
引用
收藏
页码:3006 / 3011
页数:6
相关论文
共 19 条
[1]   APPLICATION OF ZINC-OXIDE VARISTORS [J].
GUPTA, TK .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1990, 73 (07) :1817-1840
[2]  
GURAK NR, 1987, AM CERAM SOC BULL, V66, P1495
[3]  
HYATT EP, 1986, AM CERAM SOC BULL, V65, P637
[4]  
HYATT EP, 1989, AM CERAM SOC BULL, V68, P869
[5]  
JONES RD, 1982, HYBRID CIRCUIT DESIG, P22
[6]  
KAISER HD, 1972, SOLID STATE TECHNOL, V5, P35
[7]   PHASE IDENTIFICATION AND ELECTRICAL-PROPERTIES IN ZNO-GLASS VARISTORS [J].
LEE, YS ;
TSENG, TY .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1992, 75 (06) :1636-1640
[8]  
LEVINSON LM, 1986, AM CERAM SOC BULL, V65, P639
[9]   ZNO VARISTORS FOR TRANSIENT PROTECTION [J].
LEVINSON, LM ;
PHILIPP, HR .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (04) :338-343
[10]  
LICARI JJ, 1988, HYBRID MICROCIRCUIT, P79