CURE KINETICS OF AN EPOXY-NOVOLAC MOLDING COMPOUND

被引：44

作者：

HSIEH, TH

SU, AC

机构：

[1] Institute of Materials Science and Engineering, National Sun Yat-Sen University, Kaohsiung

来源：

JOURNAL OF APPLIED POLYMER SCIENCE | 1990年 / 41卷 / 5-6期

关键词：

D O I：

10.1002/app.1990.070410535

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

The cure reaction of an epoxy‐novolac molding compound was studied by means of differential scanning calorimetry using the dynamic (i.e., temperature scanning) approach. Based on a modified version of Friedman's method, a procedure aiming at the phenomenological description of cure kinetics was developed. This method was found capable of following satisfactorily the thermokinetics of the molding compound. Our results indicate that the cure reaction is autocatalytic in nature and does not follow simple nth‐order kinetics. Copyright © 1990 John Wiley & Sons, Inc.

引用

页码：1271 / 1280

页数：10

共 29 条

[1] DIFFERENTIAL SCANNING CALORIMETRY CURE STUDIES OF TETRA-N-GLYCIDYLDIAMINODIPHENYLMETHANE EPOXY-RESINS .1. REACTION WITH 4,4'-DIAMINODIPHENYLSULFONE [J].