THE ANODIC BEHAVIOR OF TIN IN SULFURIC-ACID-SOLUTIONS

被引：27

作者：

LAITINEN, T ^{[1
]}

SALMI, K ^{[1
]}

SUNDHOLM, G ^{[1
]}

VIINIKKA, P ^{[1
]}

YLIPENTTI, A ^{[1
]}

机构：

[1] HELSINKI UNIV TECHNOL,PHYS CHEM & ELECTROCHEM LAB,SF-02150 ESPOO,FINLAND

来源：

ELECTROCHIMICA ACTA | 1992年 / 37卷 / 10期

基金：

芬兰科学院;

关键词：

TIN ELECTRODE; RRDE; TIN DISSOLUTION; SULFURIC ACID;

D O I：

10.1016/0013-4686(92)85083-W

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The anodic dissolution and partial passivation of tin in 4.5-8 M sulphuric acid solutions has been studied using rotating ring-disk voltammetry. In the region of active dissolution a Tafel slope of 1/(30 +/- 3) mV-1 was measured. This value was found to be independent of acid concentration. A reaction mechanism is presented to explain this slope. It was found that tin dissolves both in the active and partly passive potential region in the form of bivalent tin. Oxidation to the tetravalent state seems to occur only at high anodic potentials. Oxygen evolution starts only at potentials above 3 V (vs. Hg2SO4/Hg). Analysis of the passivating film formed on the electrode surface using SEM, XRD, XPS and SIMS showed that the film is mainly tin oxide, SnO, mostly in an amorphic form.

引用

页码：1797 / 1803

页数：7

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