ANALYSIS OF 3-D METALLIZATION STRUCTURES BY A FULL-WAVE SPECTRAL DOMAIN TECHNIQUE

被引：70

作者：

BECKS, T

WOLFF, I

机构：

[1] Department of Electrical Engineering, and Sonderforschungsbereich 254, Duisburg University, Duisburg, Bismarckstr. 81

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1992年 / 40卷 / 12期

关键词：

D O I：

10.1109/22.179883

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

A full-wave method for the investigation of microstrip- and coplanar-structures including 3-D metallization structures is presented. The spectral domain analysis method is used to calculate the S-parameters of unshielded microwave components containing bond-wires and air-bridges. The general formulation and the implementation procedure of the method are described. The application of the theory is given by a comparison of measured and calculated results for a spiral inductor, including an air-bridge.

引用

页码：2219 / 2227

页数：9

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