THERMAL EXPANSION OF LEAD AT LOW TEMPERATURES

被引：19

作者：

CHANNING, DA

WEINTROUB, S

机构：

来源：

CANADIAN JOURNAL OF PHYSICS | 1965年 / 43卷 / 05期

关键词：

D O I：

10.1139/p65-090

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

引用

页码：955 / +

页数：1

共 14 条

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[8]

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[9] A SIMPLE METHOD OF MAKING VACUUM-TIGHT COOLABLE WINDOW SEALS FOR LOW TEMPERATURE OPTICAL TRANSMISSION CELLS [J].

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[10] COEFFICIENTS OF THERMAL EXPANSION OF SOLIDS AT LOW TEMPERATURES .1. THE THERMAL EXPANSION OF COPPER FROM 15 TO 300-DEGREES-K [J].

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