TENSILE PROPERTIES OF ACID COPPER ELECTRODEPOSITS

被引：20

作者：

ANDERSON, D

HAAK, R

OGDEN, C

TENCH, D

WHITE, J

机构：

[1] Rockwell Int Science Cent, Thousand, Oaks, CA, USA, Rockwell Int Science Cent, Thousand Oaks, CA, USA

来源：

JOURNAL OF APPLIED ELECTROCHEMISTRY | 1985年 / 15卷 / 05期

关键词：

CATHODES - Surfaces - COPPER COMPOUNDS - Electrodeposition - ELECTROPLATING - SULFURIC ACID;

D O I：

10.1007/BF00620558

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

For proprietary acid copper sulfate electroplating baths representing two major categories identified previously, deposit tensile properties are presented as functions of the bath additive and chloride concentrations. The effects of species that accumulate in the bath during circuit board plating and of variations in current density and the concentrations of copper sulfate and sulfuric acid are also discussed.

引用

页码：631 / 637

页数：7

共 9 条

[1] FREITAG WO, 1983, PLAT SURF FINISH, V70, P55
[2] EVALUATION OF AGITATION WITHIN CIRCUIT-BOARD THROUGH-HOLES
HAAK, R
OGDEN, C
TENCH, D
[J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 1981, 11 (06) : 771 - 780
[3] HAAK R, 1981, PLAT SURF FINISH, V68, P59
[4] Hagge J. K., 1980, Printed Circuit World Expo '80, P32
[5] HILL MRH, 1978, J ELECTROANAL CHEM, V86, P179
[6] TENSILE PROPERTIES AND MORPHOLOGY OF PYROPHOSPHATE COPPER-DEPOSITS
OGDEN, C
TENCH, D
WHITE, J
[J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 1982, 12 (05) : 619 - 626
[7] OGDEN C, 1980, PLAT SURF FINISH, V67, P50
[8] THE RELATION BETWEEN THE ADSORPTION OF SURFACE-ACTIVE ADDITIVES AND THE BRIGHTNESS OF ELECTROLYTICALLY DEPOSITED COPPER COATINGS
STOYCHEV, DS
VITANOVA, I
VITANOV, T
RASHKOV, S
[J]. SURFACE TECHNOLOGY, 1980, 10 (03): : 209 - 217
[9] MECHANISM OF THE ELECTRODEPOSITION AND DISSOLUTION OF COPPER IN AN ACID COPPER-SULFATE BATH .5. ACCELERATION MECHANISM IN THE PRESENCE OF CL- IONS
YOKOI, M
KONISHI, S
HAYASHI, T
[J]. DENKI KAGAKU, 1983, 51 (06): : 460 - 464

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