MICROMACHINED THERMAL-RADIATION EMITTER FROM A COMMERCIAL CMOS PROCESS

被引:59
作者
PARAMESWARAN, M
ROBINSON, AM
BLACKBURN, DL
GAITAN, M
GEIST, J
机构
[1] UNIV ALBERTA,DEPT ELECT ENGN,EDMONTON T6G 2G7,ALBERTA,CANADA
[2] UNIV ALBERTA,ALBERTA MICROELECTR CTR,EDMONTON T6G 2G7,ALBERTA,CANADA
[3] NATL INST STAND & TECHNOL,GAITHERSBURG,MD 20899
基金
加拿大自然科学与工程研究理事会;
关键词
D O I
10.1109/55.75702
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Fabrication of thermally isolated micromechanical structures capable of generating thermal radiation for dynamic thermal scene simulation (DTSS) is described. Complete compatibility with a commercial CMOS process is achieved through design of a novel, but acceptable, layout for implementation by the CMOS foundry using its regular process sequence. Following commercial production and delivery of the CMOS chips, a single maskless etch in an aqueous ethylenediamine-pyrocatechol mixture (EDP) is performed to realize the micromechanical structures. The resulting structures are suspended plates consisting of polysilicon resistors encapsulated in the field and CVD oxides available in the CMOS process. The plates are suspended by aluminum heater leads that are also encapsulated in the field and CVD oxides. Studies of the suitability of these structures for DTSS have been initiated, and early favorable results are reported.
引用
收藏
页码:57 / 59
页数:3
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