Adhesive properties of cured phenylethynyl-terminated imide oligomers

被引：34

作者：

Jensen, BJ ^{[1
]}

Bryant, RG ^{[1
]}

Smith, JG ^{[1
]}

Hergenrother, PM ^{[1
]}

机构：

[1] NASA, Langley Res Ctr, Hampton, VA 23681 USA

来源：

JOURNAL OF ADHESION | 1995年 / 54卷 / 1-2期

关键词：

adhesion; phenylethynyl-terminated imides; polyimides; high performance adhesives; pseudo thermoset resins; lap shear strength; tensile strength; tensile modulus; peel strength;

D O I：

10.1080/00218469508014381

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

As part of a program to develop structural adhesives for high performance aerospace applications, phenylethynyl-terminated imide oligomers are under evaluation. Imide oligomers with different molecular weights and compositions endcapped with either 4-(3-aminophenoxy)-4'-phenylethynylbenzophenone (3-APEB) or 4-phenylethynylphthalic anhydride (PEPA) have been prepared and characterized. These oligomers exhibit excellent processability. After heating to 350 degreesC for 1 hour, the terminal phenylethynyl groups have reacted to provide chain extension, branching and crosslinking. The cured polymers exhibit excellent solvent resistance and high mechanical properties as neat resins and in various adhesive forms (tensile shear, sandwich flatwise tension and climbing drum peel specimens). The chemistry and properties of these phenylethynyl-terminated imide oligomers are discussed.

引用

页码：57 / 66

页数：10

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