DEVELOPMENT OF AN ANISOTROPIC CONDUCTIVE ADHESIVE FILM (ACAF) FROM EPOXY-RESINS

被引：54

作者：

ASAI, SI

SARUTA, U

TOBITA, M

TAKANO, M

MIYASHITA, Y

机构：

[1] Research Center of Denki Kagaku Kogyo K.K, Tokyo, 194

[2] Chiba Plant of Denki Kagaku Kogyo K. K., Chiba, 290, 6 Minamikaigan, Goi, Ichihara City

来源：

JOURNAL OF APPLIED POLYMER SCIENCE | 1995年 / 56卷 / 07期

关键词：

D O I：

10.1002/app.1995.070560702

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

A thermoset type anisotropic conductive adhesive film (ACAF), which electrically connects an ITO glass and a flex circuit both having conducting patterns of less than 100 mu m in pitch, has been developed. In this development, bisphenol A and bisphenol F epoxy resins were tested to formulate an ACAF with easy-to-handle tackiness, flexibility, and strength. A curing agent that gives fast cure and long shelf-life properties to the epoxy resin was also selected. The tensile stress-strain responses of obtained adhesive films were successfully used for determining the formulation. Good aftercure physical properties (electrical and mechanical) were obtained. Durability against high temperature and high humidity were also tested to confirm long-term stability of the conduction of this ACAF. (C) 1995 John Wiley and Sons, Inc.

引用

页码：769 / 777

页数：9