PARAMETRIC STUDY OF HEATSPREADER THERMAL PERFORMANCE IN 48 LEAD PLASTIC DIPS AND 68 LEAD PLASTIC LEADED CHIP CARRIERS

被引：4

作者：

AGHAZADEH, M

NATARAJAN, B

机构：

[1] Intel Corp, Chandler, AZ, USA, Intel Corp, Chandler, AZ, USA

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1986年 / 9卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1986.1136690

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：347 / 352

页数：6

共 8 条

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MAHALINGAM, LM ;

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[2]

BERG H, 1979, IEEE T COMPONENTS HY, V2, P500

[3] VLSI THERMAL MANAGEMENT IN COST DRIVEN SYSTEMS [J].

LEWIS, TE ;

ADAMS, DL .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1982, 5 (04) :361-367

[4]

Mahalingam L. M., 1983, Semiconductor International, V6, P76

[5]

MAHALINGAM LM, 1985, IEEE P, V73, P1396

[6]

MANCHESTER KE, 1980, IEEE T COMPONENTS HY, V3, P550

[7]

OETTINGER FF, 1984, SOLID STATE TECH FEB, P169

[8]

SIEGEL BS, 1978, ELECTRONICS, P121