COMPARATIVE-STUDY OF 3D MEASUREMENT TECHNIQUES (SPM, SEM, TEM) FOR SUBMICRON STRUCTURES

被引：6

作者：

VANHELLEPUTTE, HRJR

HADDEMAN, TBJ

VERHEIJEN, MJ

BAALBERGEN, JJ

机构：

来源：

MICROELECTRONIC ENGINEERING | 1995年 / 27卷 / 1-4期

关键词：

D O I：

10.1016/0167-9317(94)00164-P

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Non destructive measurements are of great interest in 3D metrology (contact holes, grating structures and resist profiles). Conventional measurement techniques to obtain 3D information are SEM and TEM cross section, but are destructive. In this report a comparative study is presented between SPM, SEM and TEM. Simulations and measurements indicate that the tip shape is the limiting factor for using SPM as a 3D measurement tool. Pitch and height can be measured accurately with SPM, provided good calibration. Linewidth measurements show a dead zone, depending on tip geometry.

引用

页码：547 / 550

页数：4