MICROANALYSIS OF COPPER-TIN PHASES IN DENTAL AMALGAM

被引：12

作者：

JOHNSON, LN

ASGAR, K

PEYTON, FA

机构：

[1] Department of Dental Materials, School of Dentistry, University of Michigan, Ann Arbor

来源：

JOURNAL OF DENTAL RESEARCH | 1969年 / 48卷 / 5P2期

关键词：

D O I：

10.1177/00220345690480054301

中图分类号：

R78 [口腔科学];

学科分类号：

1003 ;

摘要：

An etch resistance phase was found in dental silver amalgam when the amalgam was examined metallographically. This phase was common to the silver alloy ingot as well as to its prepared amalgam. Qualitative electron microprobe technics were used to identify this phase. Quantitative electron microprobe analysis defined it as the ή phase of the copper-tin system or the intermetallic compound Cu6Sn5. © 1969, SAGE Publications. All rights reserved.

引用

页码：872 / &

共 15 条

[1] MICROSTRUCTURE OF DENTAL AMALGAM [J].