SOLDERING EXTERNAL CONNECTIONS TO THIN-FILM SYSTEMS

被引：40

作者：

KELLER, HN ^{[1
]}

MORABITO, JM ^{[1
]}

机构：

[1] BELL TEL LABS INC,ALLENTOWN,PA 18103

来源：

关键词：

D O I：

10.1002/sia.740030108

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

引用

页码：16 / 22

页数：7

共 7 条

[1] BADER WG, 1969, WELDING RES S JUN, P551
[2] Condra L. W., 1977, 27th Electronic Components Conference, P135
[3] FOSTER FG, 1962, ASTM STP, V319, P13
[4] TEMPERATURE AGING OF EXTERNAL CONNECTIONS CONDENSATION SOLDERED TO TI-PD-AU THIN-FILMS
KELLER, HN
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (02): : 180 - 195
[5] RELIABILITY OF CLIP-ON TERMINALS SOLDERED TO TA-TA2N-NICR-PD-AU THIN-FILMS
KELLER, HN
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (03): : 294 - 301
[6] Minetti R. H., 1977, 27th Electronic Components Conference, P212
[7] MINETTI RH, 1979, P NATIONAL ELECTRONI, P410