VACANCY - SCANDIUM INTERACTION IN QUENCHED COPPER

被引:10
作者
BERGER, AS
SIEGEL, RW
机构
[1] Materials Sci. Div., Argonne Nat. Lab., Argonne
来源
JOURNAL OF PHYSICS F-METAL PHYSICS | 1979年 / 9卷 / 04期
关键词
D O I
10.1088/0305-4608/9/4/002
中图分类号
O59 [应用物理学];
学科分类号
摘要
The effects of the addition of trace amounts (12-96 at PPM) of Sc upon the annealing of otherwise high-purity Cu quenched from 600-700 degrees C has been investigated. The Sc solute was observed to suppress the normal post-quench vacancy annealing in Cu, apparently by the formation of highly stable vacancy-Sc complexes which subsequently annealed only at temperatures in excess of approximately 300 degrees C.
引用
收藏
页码:L67 / L71
页数:5
相关论文
共 5 条