ELECTRICAL AND STRUCTURAL-PROPERTIES OF NICR THIN-FILM RESISTORS REACTIVELY SPUTTERED IN O2

被引：26

作者：

HARDY, WR ^{[1
]}

MURTI, DK ^{[1
]}

机构：

[1] MCMASTER UNIV,HAMILTON,ONTARIO,CANADA

来源：

THIN SOLID FILMS | 1974年 / 20卷 / 02期

关键词：

D O I：

10.1016/0040-6090(74)90070-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：345 / 362

页数：18

共 26 条

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[5]

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[7]

Chopra K.L, 1969, THIN FILM PHENOMENA

[8] INFLUENCE OF DEPOSITION PARAMETERS ON COALESCENCE STAGE OF GROWTH OF METAL FILMS [J].

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[9]

DEGENHART JH, 1963, 10 T NATL VAC S, P480

[10] STRUCTURE AND GROWTH OF SILVER FILMS CONDENSED AT OBLIQUE VAPOUR INCIDENCE, AND THEIR DEPENDENCE ON FILM THICKNESS AND RESIDUAL AIR PRESSURE [J].

DUTTA, PK ;

WILMAN, H .

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