ELECTROTHERMAL SIMULATION AND DESIGN OF INTEGRATED-CIRCUITS

被引：59

作者：

VANPETEGEM, W ^{[1
]}

GEERAERTS, B ^{[1
]}

SANSEN, W ^{[1
]}

GRAINDOURZE, B ^{[1
]}

机构：

[1] ALCATEL,MIETEC,B-1130 BRUSSELS,BELGIUM

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1994年 / 29卷 / 02期

关键词：

D O I：

10.1109/4.272120

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An accurate prediction of the electrothermal behavior of power integrated devices is required to design circuits in an efficient way. An electrothermal simulator (ETS) is a combination of SPICE with finite element code, in a relaxation procedure. It simulates the full electrothermal behavior of integrated circuits. Static and dynamic simulations of typical examples, reveal the value of ETS for high-power applications. Some specific design rules are derived. They are simple formulas, which estimate the temperature (gradients) on chip. They can be used before any CPU-time consuming simulation takes place which allows a more efficient design and prototype phase.

引用

页码：143 / 146

页数：4

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