RELOCATION PROFILOMETRY

被引：32

作者：

WILLIAMSON, JB

HUNT, RT

机构：

[1] Burndy Research Division, Norwalk, CT

来源：

JOURNAL OF PHYSICS E-SCIENTIFIC INSTRUMENTS | 1968年 / 1卷 / 07期

关键词：

D O I：

10.1088/0022-3735/1/7/312

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

Relocation profilometry allows a series of surface profiles to be recorded from the same track on a specimen which may be removed from the profile measuring instrument between observations. It depends upon a simple relocating stage which is able to place a specimen within 5 μin of its original position. Some applications of relocation profilmetry in the study of surface deformation during mechanical contact and in electroplating research are described.

引用

页码：749 / +

页数：1