EFFECT OF HIPING ON THE EFFECTIVE THERMAL-CONDUCTIVITY DIFFUSIVITY AND THE INTERFACIAL THERMAL CONDUCTANCE OF UNIAXIAL SIC FIBER-REINFORCED RBSN

被引:35
作者
BHATT, H [1 ]
DONALDSON, KY [1 ]
HASSELMAN, DPH [1 ]
BHATT, RT [1 ]
机构
[1] NASA,LEWIS RES CTR,DIV MAT,CERAM BRANCH,CLEVELAND,OH 44135
关键词
D O I
10.1007/BF01165950
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Hot isostatic pressing (HIPing) was found to increase the thermal diffusivity/conductivity of uniaxial silicon carbide fibre-reinforced reaction-bonded silicon nitride (RBSN) matrix composites, as the result of the densification of the matrix, the increase in the grain size of the silicon carbide and the improved thermal contact between the fibres and the matrix. Transverse to the fibre direction the thermal diffusivity/conductivity was found to be a function of the surrounding gaseous atmosphere due to the access of the gas phase to the fibre matrix interface, which was facilitated by the existence of an interfacial gap due to the thermal expansion mismatch between the fibres and the matrix. The interfacial conductance was found to exhibit a strong positive temperature dependence as the result of the closure of the interfacial gap with increasing temperature.
引用
收藏
页码:6653 / 6661
页数:9
相关论文
共 27 条
[1]  
[Anonymous], 1892, PHILOS MAG
[3]   ROLE OF THE INTERFACIAL THERMAL BARRIER IN THE EFFECTIVE THERMAL-DIFFUSIVITY CONDUCTIVITY OF SIC-FIBER-REINFORCED REACTION-BONDED SILICON-NITRIDE [J].
BHATT, H ;
DONALDSON, KY ;
HASSELMAN, DPH ;
BHATT, RT .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1990, 73 (02) :312-316
[4]  
BHATT H, 1990, THERMAL CONDUCTIVITY, V21, P597
[6]   PREDICTION OF THERMAL CONDUCTIVITY OF 2-PHASE AND 3-PHASE SOLID HETEROGENEOUS MIXTURES [J].
CHENG, SC ;
VACHON, RI .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1969, 12 (03) :249-&
[7]   EFFECTIVE CONDUCTIVITY OF DISPERSIONS - THE EFFECT OF RESISTANCE AT THE PARTICLE SURFACES [J].
CHIEW, YC ;
GLANDT, ED .
CHEMICAL ENGINEERING SCIENCE, 1987, 42 (11) :2677-2685
[8]  
DELARUE RE, 1959, J ELECTROCHEM SOC, V106, P827
[10]  
Hasselman D. P. H., 1989, THERMAL CONDUCTIVITY, P141