KINETICS OF DEPOSITION OF ALUMINA PARTICLES FROM COPPER-SULFATE PLATING BATHS

[1] CELIS JP, TO BE PUBLISHED

[2] CELIS JP, 1976, THESIS KATHOLIEKE U

[3] CODEPOSITION OF ALUMINA AND TITANIA WITH COPPER [J]. METALLURGICAL TRANSACTIONS, 1971, 2 (04): : 937 - +

[4] KINETICS OF DEPOSITION OF INERT PARTICLES FROM ELECTROLYTIC BATHS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (08) : 1009 - +

[5] Kariapper A.M.J., 1974, T I MET FINISH, V52, P87, DOI DOI 10.1080/00202967.1974.11870311

[6] Kedward E.C., 1974, TRIBOL INT, V7, P221, DOI 10.1016/0041-2678(74)90120-1

[7] NECKARSULM NSU, 1970, Patent No. 1200410

[8] ELECTRODEPOSITION OF DISPERSION-HARDENED NICKEL-AL2O3 ALLOYS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1963, 110 (06) : 557 - 563

[9] Snaith D.W., 1972, T IMF, V50, P95, DOI [10.1080/00202967.1972.11870227, DOI 10.1080/00202967.1972.11870227]

[10] Tomasaewski T.W., 1969, PLATING, V56, P1234

[1] CELIS JP, TO BE PUBLISHED

[2] CELIS JP, 1976, THESIS KATHOLIEKE U

[3] CODEPOSITION OF ALUMINA AND TITANIA WITH COPPER [J]. METALLURGICAL TRANSACTIONS, 1971, 2 (04): : 937 - +

[4] KINETICS OF DEPOSITION OF INERT PARTICLES FROM ELECTROLYTIC BATHS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (08) : 1009 - +

[5] Kariapper A.M.J., 1974, T I MET FINISH, V52, P87, DOI DOI 10.1080/00202967.1974.11870311

[6] Kedward E.C., 1974, TRIBOL INT, V7, P221, DOI 10.1016/0041-2678(74)90120-1

[7] NECKARSULM NSU, 1970, Patent No. 1200410

[8] ELECTRODEPOSITION OF DISPERSION-HARDENED NICKEL-AL2O3 ALLOYS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1963, 110 (06) : 557 - 563

[9] Snaith D.W., 1972, T IMF, V50, P95, DOI [10.1080/00202967.1972.11870227, DOI 10.1080/00202967.1972.11870227]

[10] Tomasaewski T.W., 1969, PLATING, V56, P1234