MEASUREMENTS OF CROSSTALK BETWEEN CLOSELY-PACKED LOSSY MICROSTRIPS ON SILICON SUBSTRATES

被引：8

作者：

LIN, MS

ENGVIK, AH

LOOS, JS

机构：

[1] AT & T Bell Laboratories, Murray Hill

来源：

ELECTRONICS LETTERS | 1990年 / 26卷 / 11期

关键词：

Crosstalk; Integrated circuits; Microstrip;

D O I：

10.1049/el:19900466

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The measured near-end and far-end crosstalks for closelypacked microstrips are reported. The near-end crosstalk isless than 10% and the far-end crosstalk is less than 5% (of the driven signal) between two microstrips with 10µm width and 10µm spacing, when the active line is driven by a fast step pulse with ~40ps rise time. Based on our measurements, we believe that closely-packed lossy microstrips can be used for high speed digital signal transmission, without much concern of crosstalk. © 1990, The Institution of Electrical Engineers. All rights reserved.

引用

页码：714 / 716

页数：3

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