ADVANTAGES AND SPECIAL CONSIDERATIONS IN FABRICATING BUBBLE CIRCUITS BY ELECTROPLATING AND SPUTTER ETCHING

被引:20
作者
ROMANKIW, LT [1 ]
KRONGELB, S [1 ]
CASTELLA.EE [1 ]
PFEIFFER, AT [1 ]
STOEBER, BJ [1 ]
OLSEN, JD [1 ]
机构
[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
关键词
D O I
10.1109/TMAG.1974.1058384
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:828 / 831
页数:4
相关论文
共 13 条
  • [1] Almasi G. S., 1972, AIP Conference Proceedings, P207
  • [2] BOSCH LJ, 1973, IEEE T MAGNETICS, VMAG5, P481
  • [3] HORSTMANN RE, 1973, OVERLAY FABRICATION
  • [4] HORSTMANN RE, 1972, FALL M EL SOC MIAM
  • [5] Krongelb S., 1973, Journal of Electronic Materials, V2, P227, DOI 10.1007/BF02666155
  • [6] ROMANKIW LT, 1973, AUG INT C MAGN MOSC
  • [7] ROMANKIW LT, 1974, SPR EL SOC M SAN FRA
  • [8] WOLF IW, 1957, J APPL PHYS S, V33, P1152
  • [9] 1973, 4 PLAT EL IND S IND, P225
  • [10] PM01155A SEL REX CO