PHOTORESIST CHANNEL-CONSTRAINED DEPOSITION OF ELECTROLESS METALLIZATION ON LIGATING SELF-ASSEMBLED FILMS

被引:28
作者
CALVERT, JM
CALABRESE, GS
BOHLAND, JF
CHEN, MS
DRESSICK, WJ
DULCEY, CS
GEORGER, JH
KOSAKOWSKI, J
PAVELCHECK, EK
RHEE, KW
SHIREY, LM
机构
[1] SHIPLEY CO INC, MARLBOROUGH, MA 01752 USA
[2] GEOCENTERS INC, FT WASHINGTON, MD 20744 USA
[3] SACHS FREEMAN ASSOCIATES INC, LANDOVER, MD 20785 USA
[4] USN, RES LAB, NANOELECTR PROD FACIL, WASHINGTON, DC 20375 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1994年 / 12卷 / 06期
关键词
D O I
10.1116/1.587568
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:3884 / 3887
页数:4
相关论文
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