PARTIALLY BONDED BIMATERIAL PLANE UNDER TENSION

被引:11
作者
HASEBE, N [1 ]
OKUMURA, M [1 ]
NAKAMURA, T [1 ]
机构
[1] TOKYU CONSTRUCT CO LTD,SIBUYA,TOKYO,JAPAN
来源
JOURNAL OF ENGINEERING MECHANICS-ASCE | 1990年 / 116卷 / 09期
关键词
D O I
10.1061/(ASCE)0733-9399(1990)116:9(2017)
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
A bimaterial problem is considered for shapes that are symmetrical with respect to an interface that is finite and straight. A rational mapping function and complex stress functions are used to obtain a general solution for bonded halfplanes with cracks at an end of the interface. A stress analysis is carried out for a state of uniform tension at infinity, which is either symmetrical or antisymmetrical with respect to the interface. Stress distributions and stress-intensity factors are obtained for various crack length and elastic constants. When one material is in tension and the other is free from traction, stress-intensity factors are also investigated. The bond effects on the stress-intensity factors are studied. The elastic constant's effects on the stress-intensity factor for a short crack and the stress function for special material constants are also investigated. © ASCE.
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收藏
页码:2017 / 2034
页数:18
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