THERMODYNAMIC ANALYSIS OF COPPER CVD USING CUCL AS PRECURSOR

[1] Balde, Journal of Elect. Mat., 18, 2, (1989)

[2] Houle, Jones, Baum, Pico, Kovac, Appl. Phys. Lett., 46, (1985)

[3] Temple, Reisman, J. Electrochem. Soc., 136, (1989)

[4] Hampden-Smith, Kodas, Paffett, Farr, Shin, Adv. Mater., 2, (1990)

[5] Beach, Legoues, Hu, Low-temperature chemical vapor deposition of high purity copper from an organometallic source, Chemistry of Materials, 2, (1990)

[6] Lampe-onnerud, Harsta, Jansson, Proc. of 8th Euro. CVD, J. de Phys. Coll. C2, 1, (1991)

[7] Pauleau, Bull. Soc. Chem. Fr., 4, (1985)

[8] JANAF, Thermochemical tables, Journal of Physical and Chemical Reference Data, 14, (1985)

[9] Stolt, d'Heurle, Harper, Thin Solid Films, 200, (1991)

[1] Balde, Journal of Elect. Mat., 18, 2, (1989)

[2] Houle, Jones, Baum, Pico, Kovac, Appl. Phys. Lett., 46, (1985)

[3] Temple, Reisman, J. Electrochem. Soc., 136, (1989)

[4] Hampden-Smith, Kodas, Paffett, Farr, Shin, Adv. Mater., 2, (1990)

[5] Beach, Legoues, Hu, Low-temperature chemical vapor deposition of high purity copper from an organometallic source, Chemistry of Materials, 2, (1990)

[6] Lampe-onnerud, Harsta, Jansson, Proc. of 8th Euro. CVD, J. de Phys. Coll. C2, 1, (1991)

[7] Pauleau, Bull. Soc. Chem. Fr., 4, (1985)

[8] JANAF, Thermochemical tables, Journal of Physical and Chemical Reference Data, 14, (1985)

[9] Stolt, d'Heurle, Harper, Thin Solid Films, 200, (1991)