DSC AND TBA STUDIES OF THE CURING BEHAVIOR OF 2 DICY-CONTAINING EPOXY-RESINS

被引：86

作者：

SCHNEIDER, NS ^{[1
]}

SPROUSE, JF ^{[1
]}

HAGNAUER, GL ^{[1
]}

GILLHAM, JK ^{[1
]}

机构：

[1] PRINCETON UNIV,DEPT CHEM ENGN,PROGRAM POLYMER MAT,PRINCETON,NJ 08540

来源：

POLYMER ENGINEERING AND SCIENCE | 1979年 / 19卷 / 04期

关键词：

D O I：

10.1002/pen.760190413

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

The curing behavior of two commercial dicy‐containing resins (I & II), both with recommended cures of 127°C/2 h, has been studied by differential scanning calorimetry (DSC), torsional braid analysis (TBA) and Fourier Transform infrared spectroscopy. Compositional analysis reveals that the two resins differ primarily in the amine/epoxy ratio and the nature of the main epoxy components. Factors contributing to the complex curing behavior observed with II are identified. Isothermal kinetic runs by DSC and TBA lead to estimates for the conversion at the gel point, and to results which suggest that the reactions of epoxy with amine and hydroxyl occur with similar activation energies and similar heats of reaction. Copyright © 1979 Society of Plastics Engineers, Inc.

引用

页码：304 / 312

页数：9

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