STRENGTH OF ELECTROSTATIC INTERACTION CREATED BETWEEN GRAINS OF VERY THIN METALLIC DEPOSIT AND BETWEEN EACH OF THEM AND SUBSTRATE, DOUBLE-LAYER FORMING INTERFACE

被引：5

作者：

DESROUSSEAUX, G ^{[1
]}

机构：

[1] UNIV AIX MARSEILLE 3, FAC SCI & TECH ST JEROME, CTR ETUD COUCHES MINCES, CNRS LAB, 13397 MARSEILLE, FRANCE

来源：

关键词：

D O I：

10.1016/0040-6090(74)90302-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：317 / 321

页数：5

共 5 条

[1] DIPOLAR INTERACTION FORCES CAPABLE OF PROVOKING MIGRATION OF GRAINS OF A VERY THIN METAL LAYER DEPOSITED BY THERMAL EVAPORATION
DESROUSSEAUX, G
[J]. JOURNAL DE PHYSIQUE, 1972, 33 (04): : 401 - +
[2] INTERGRANULAR FORCES OF DYNAMIC COALESCENCE IN VERY THIN METALLIC-FILMS
DESROUSSEAUX, G
CARLAN, A
[J]. JOURNAL OF APPLIED PHYSICS, 1974, 45 (02) : 583 - 587
[3] DESROUSSEAUX G, 1973, THESIS MARSEILLE
[4] DESROUSSEAUX G, 1973, CR ACAD SCI PARIS B, V233, P10
[5] FAURE R, 1974, CR ACAD SCI SEA 0218