AUGER ANALYSIS OF THICK SILVER FILMS AND OF SILVER LAYERS GROWN ON COPPER

被引：29

作者：

NAMBA, Y

VOOK, RW

机构：

来源：

关键词：

D O I：

10.1016/0040-6090(81)90440-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：165 / 177

页数：13

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