THE REPASSIVATION KINETICS OF PURE NICKEL IN A NA2SO4 SOLUTION USING ABRADING ELECTRODE TECHNIQUE

被引:41
作者
PYUN, SI
HONG, MH
机构
[1] Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejon
关键词
REPASSIVATION KINETICS OF NI; ABRADING ELECTRODE TECHNIQUE; APPLIED POTENTIAL; CL-ION CONCENTRATION; TRANSITION TIME IN CURRENT DECAY TRANSIENTS;
D O I
10.1016/0013-4686(92)87080-J
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The repassivating kinetics of Ni have been investigated by the abrading electrode technique. The early stage of repassivation kinetics of pure nickel have been studied as a function of applied potential and Cl- ion concentration in 0.75 M Na2SO4 solutions of pH 2.8. The applied potential and Cl- ion concentration ranged from -200 to 600 mV(sce) and from 0 to 0.2 M, respectively. Transition time t(T) at which current decay transients intersect for given applied potentials decreased with increasing applied potential. In the absence of the Cl- ion, the current decay rate increased with increasing applied potential from 0 to 600 mV(sce). As the Cl- ion concentration increased at a given applied potential, the current density increased below t(T), whereas it decreased above t(T). The repassivation kinetics with respect to the Cl- ion have been discussed in terms of competitive adsorption of Cl- and OH-/O2- ions. As a result it is suggested that below t(T), the increased current density by the addition of Cl- ion is caused by the preferential adsorption of Cl- ion and the inhibition of the adsorption of OH- ion on the nickel surface. Above t(T), the decreased current density by the addition of Cl- ion is based upon the fact that the adsorbed Cl- ion facilitates the place exchange reaction between metal and hydroxyl ions, and hence the film formation.
引用
收藏
页码:2437 / 2442
页数:6
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