PATTERNING OF SUB-MICRON METAL FEATURES AND PILLARS IN MULTILEVEL METALLIZATION

被引：10

作者：

KULKARNI, VD

SHARMA, NC

机构：

来源：

关键词：

D O I：

10.1149/1.2095508

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：3094 / 3098

页数：5

共 18 条

[1]

BARTUSH TA, 1987, P IEEE VLSI MULTILEV, P41

[2]

BOHLAND JF, 1985, P SPIE, V539, P265

[3]

BOLSEN M, 1986, SOLID STATE TECHNOL, V29, P83

[4]

BURGGRAAF P, 1985, SEMICONDUCTOR IN OCT, P88

[5]

CASTEL ED, 1987, ELECTROCHEMICAL SOC, V8711, P544

[6]

ELDIWANY MH, 1987, IEDM TECH DIG, P917

[7]

Flamm D.L., 1981, PLASMA CHEM PLASMA P, V1, P317, DOI [10.1007/bf00565992, DOI 10.1007/BF00565992]

[8]

GRIFFING BF, 1983, P SOC PHOTO-OPT INS, V394, P33

[9]

HASEGAWA I, 1985, P DRY PROCESS S, P126

[10]

JOHNSON DW, 1984, SEMICOND INT MAR, P83