CURL-FREE HIGH-ADHESION POLYIMIDE/COPPER LAMINATE

被引：24

作者：

CHEN, HL ^{[1
]}

HO, SH ^{[1
]}

WANG, TH ^{[1
]}

CHEN, KM ^{[1
]}

PAN, JP ^{[1
]}

LIANG, SM ^{[1
]}

HUNG, A ^{[1
]}

机构：

[1] MING HSIN ENGN COLL, DEPT CHEM ENGN, HSINCHU, TAIWAN

来源：

JOURNAL OF APPLIED POLYMER SCIENCE | 1994年 / 51卷 / 09期

关键词：

D O I：

10.1002/app.1994.070510914

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

6-Amino-2-(p-aminophenyl) benzimidazole (BIA) was synthesized and employed as a diamine component in the preparation of polyamic acid. The mechanical and thermal properties of polyimides made from BIA as a diamine component were investigated. A high-adhesion, curl-free polyimide/copper laminate has been obtained by using BIA as a diamine component. (C) 1994 John Wiley and Sons, Inc.

引用

页码：1647 / 1652

页数：6

共 21 条

[1]

[Anonymous], 1987, J ADHES SCI TECHNOL

[2]

BERNIER MH, 1990, ACS SYM SER, V440, P147

[3] X-RAY PHOTOELECTRON-SPECTROSCOPY AND INFRARED-SPECTROSCOPY ANALYSIS OF PYROMELLITIC DIANHYDRIDE OXYDIANILINE POLYAMIDE-ACID AND POLYAMIDE-ESTER IMIDIZATION [J].