MECHANISMS OF STRESS RELIEF IN THIN FILMS

被引：15

作者：

CHAUDHARI, P

MADER, S

FREEDMAN, JF

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1969年 / 6卷 / 04期

关键词：

D O I：

10.1116/1.1315707

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：618 / +

页数：1

共 9 条

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[2] ENERGIE MUTUELLE DE DEUX DISLOCATIONS
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[3] EFFECT OF ELASTIC STRAIN ON SUPERCONDUCTING CRITICAL TEMPERATURE OF EVAPORATED TIN FILMS
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SERAPHIM, DP
[J]. JOURNAL OF APPLIED PHYSICS, 1962, 33 (01) : 163 - &
[4] MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS
CHAUDHARI, P
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (02) : 197 - +
[5] BOWING OF A DISLOCATION SEGMENT
FOREMAN, AJE
[J]. PHILOSOPHICAL MAGAZINE, 1967, 15 (137): : 1011 - &
[6] HIRTH JP, 1968, THEORY DISLOCATIONS, P145
[7] HIRTH JP, 1963, RELATION STRUCTURE S, P218
[8] Hoffman R. W., 1966, PHYS THIN FILMS, VVol. 3, pp. 211
[9] TENSILE PROPERTIES OF THIN, EVAPORATED GOLD FILMS
NEUGEBAUER, CA
[J]. JOURNAL OF APPLIED PHYSICS, 1960, 31 (06) : 1096 - 1101