CURING BEHAVIOR OF CONDUCTING POLYMER COMPOSITE

被引：6

作者：

RADHAKRISHNAN, S

机构：

[1] Natl Chemical Lab, Poona, India, Natl Chemical Lab, Poona, India

来源：

JOURNAL OF MATERIALS SCIENCE LETTERS | 1987年 / 6卷 / 02期

关键词：

PHENOLIC RESINS - Reinforcing - PLASTICS - Electric Conductivity - THERMOSETS - Curing;

D O I：

10.1007/BF01728966

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Carbon-filled polymer composites are becoming increasingly important for electrical/electronic applications. The curing behaviour of an electrically conductive composite is reported. The polymer used was phenolic grade thermoset moulding compound filled with carbon black and silica.

引用

收藏

页码：145 / 148

页数：4

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