CORROSION FAILURE MECHANISMS FOR GOLD METALLIZATIONS IN ELECTRONIC CIRCUITS

被引：32

作者：

FRANKENTHAL, RP ^{[1
]}

BECKER, WH ^{[1
]}

机构：

[1] BELL TEL LABS INC, READING, PA 19604 USA

来源：

关键词：

anodization; circuits; dendrites; film formation; moisture; water;

D O I：

10.1149/1.2128783

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

[No abstract available]

引用

页码：1718 / 1719

页数：2

共 7 条

[1] Der Marderosian A., 1977, 15th Annual Proceedings Reliability Physics, P92
[2] EFFECT OF PH ON THE RATE OF CORROSION OF GOLD IN ACID SULFATE-SOLUTIONS
DUNCAN, BS
FRANKENTHAL, RP
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (01) : 95 - 97
[3] Frankenthal R. P., 1975, Properties of Electrodeposits, P142
[4] ANODIC BEHAVIOR OF GOLD IN SULFURIC-ACID SOLUTIONS - EFFECT OF CHLORIDE AND ELECTRODE POTENTIAL
FRANKENTHAL, RP
THOMPSON, DE
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (06) : 799 - 804
[5] MIGRATORY GOLD RESISTIVE SHORTS - CHEMICAL ASPECTS OF A FAILURE MECHANISM
GRUNTHANER, FJ
GRISWOLD, TW
CLENDENING, PJ
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1975, : 99 - 106
[6] Hewlett F. W. Jr., 1976, 14th Annual Proceedings Reliability Physics, P5, DOI 10.1109/IRPS.1976.362714
[7] SCHMID GM, 1975, ENCY ELECTROCHEMISTR, V4, P87