ADVANCED PRINTED-CIRCUIT BOARD DESIGN FOR HIGH-PERFORMANCE COMPUTER-APPLICATIONS

被引：8

作者：

BONNER, RF ^{[1
]}

ASSELTA, JA ^{[1
]}

HAINING, FW ^{[1
]}

机构：

[1] IBM CORP,GEN TECHNOL DIV LAB,ENDICOTT,NY 13760

来源：

IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1982年 / 26卷 / 03期

关键词：

D O I：

10.1147/rd.263.0297

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：297 / 305

页数：9

共 16 条

[1] THERMAL CONDUCTION MODULE - A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGE [J].

BLODGETT, AJ ;

BARBOUR, DR .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) :30-36

[2] A MULTILAYER CERAMIC MULTICHIP MODULE [J].

BLODGETT, AJ .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (04) :634-637

[3]

BONNER RF, 1981, 31ST EL COMP C ATL

[4] IBM MULTICHIP MULTILAYER CERAMIC MODULES FOR LSI CHIPS - DESIGN FOR PERFORMANCE AND DENSITY [J].

CLARK, BT ;

HILL, YM .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (01) :89-93

[5]

CLARK BT, 1981, 31ST EL COMP C ATL

[6]

HARRIS JB, 1975, Patent No. 3915537

[7] CONTROLLED COLLAPSE REFLOW CHIP JOINING [J].

MILLER, LF .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (03) :239-&

[8]

MOLLEN JC, 1980, 30TH P EL COMP C SAN, P349

[9] A NEW SET OF PRINTED-CIRCUIT TECHNOLOGIES FOR THE IBM 3081 PROCESSOR UNIT [J].

SERAPHIM, DP .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) :37-44

[10]

SERAPHIM DP, 1978, IEEE T COMPON HYBR, V1, P305, DOI 10.1109/TCHMT.1978.1135287

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