HIGH-TEMPERATURE STRENGTH BEHAVIOR OF HOT-PRESSED SI3N4 - EVIDENCE FOR SUBCRITICAL CRACK GROWTH

被引：137

作者：

LANGE, FF ^{[1
]}

机构：

[1] WESTINGHOUSE RES LABS,MET & MET PROCESSING DEPT,MAT SCI SECT,PITTSBURGH,PA 15235

来源：

关键词：

D O I：

10.1111/j.1151-2916.1974.tb10819.x

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：84 / 87

页数：4

共 14 条

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[2] MICROSTRUCTURAL STUDIES ON SILICON NITRIDE
EVANS, AG
SHARP, JV
[J]. JOURNAL OF MATERIALS SCIENCE, 1971, 6 (10) : 1292 - &
[3] MICROSTRUCTURE OF HOT-PRESSED SILICON-NITRIDE
KOSSOWKS.R
[J]. JOURNAL OF MATERIALS SCIENCE, 1973, 8 (11) : 1603 - 1615
[4] KOSSOWSKY R, PRIVATE COMMUNICATIO
[5] RELATION BETWEEN STRENGTH, FRACTURE ENERGY, AND MICROSTRUCTURE OF HOT-PRESSED SI3N4
LANGE, FF
[J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1973, 56 (10) : 518 - 522
[6] LANGE FF, 1972, ASME72GT56 PUBL
[7] LANGE FF, 1972, AD738865
[8] LLOYD DE, 1968, SPECIAL CERAMICS, V4
[9] Morey George W., 1938, PROPERTIES GLASS
[10] RICHERSON DW, 1972, AM CERAM SOC B, V5, P429