EFFECT OF ADDITIVES OF THE PRESSURELESS SINTERING OF ALUMINUM NITRIDE BETWEEN 1500-DEGREES AND 1800-DEGREES-C

被引:79
作者
TROCZYNSKI, TB
NICHOLSON, PS
机构
关键词
D O I
10.1111/j.1151-2916.1989.tb07684.x
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:1488 / 1491
页数:4
相关论文
共 7 条
[1]  
AXELSON SR, 1988, 90TH ANN M AM CER SO
[2]  
DINWIDDIE RB, 1987, 89TH ANN M AM CER SO
[3]   DEVELOPMENT AND MICROSTRUCTURAL CHARACTERIZATION OF HIGH-THERMAL-CONDUCTIVITY ALUMINUM NITRIDE CERAMICS [J].
KUROKAWA, Y ;
UTSUMI, K ;
TAKAMIZAWA, H .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1988, 71 (07) :588-594
[4]  
Levin EM, 1975, PHASE DIAGRAMS CER S
[5]  
POWELL RW, 1969, THERMAL CONDUCTIVITY, pCH5
[6]  
Topfer U., 1988, CFI - Ceramic Forum International - Berichte der Deutschen Keramischen Gesellschaft, V65, P70
[7]  
YAGI T, 1988, J AM CERAM SOC, V71, pC334, DOI 10.1111/j.1151-2916.1988.tb05934.x