共 15 条
[1]
Bae K., 1988, Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Design-to-Manufacturing Transfer Cycle. Proceedings 1988 (IEEE Cat. No.88CH2648-4), P143, DOI 10.1109/EMTS.1988.16166
[2]
BAE K, 1989, 7TH P INT C FRACT 89, P1737
[3]
Bae K., 1988, INT S TEST FAIL AN A, P53
[4]
BAE K, 1989, 1989 P EL MAT PROC C, P109
[5]
BERRICHE R, 1987, 3RD P C EL PACK MAT, P169
[6]
GUO Z, 1990, 40TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1 AND 2, P496, DOI 10.1109/ECTC.1990.122234
[7]
GUO Z, 1991, 41 IEEE ECTC C ATL G, P658
[8]
A SIMPLE PROCEDURE FOR ASSESSING ENVIRONMENTAL-EFFECTS ON FATIGUE FAILURE OF SOLDER JOINTS
[J].
SCRIPTA METALLURGICA,
1988, 22 (09)
:1543-1545
[9]
LIKHTMAN VI, 1958, EFFECTS SURFACE ACTI
[10]
EFFECT OF CYCLE FREQUENCY + ATMOSPHERIC CORROSION ON FATIGUE OF LEAD
[J].
PHILOSOPHICAL MAGAZINE,
1964, 10 (105)
:435-&