GROWTH AND PASSIVATION OF ALUMINUM ETCH TUNNELS

被引：56

作者：

HEBERT, K ^{[1
]}

ALKIRE, R ^{[1
]}

机构：

[1] UNIV ILLINOIS,DEPT CHEM ENGN,URBANA,IL 61801

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1988年 / 135卷 / 09期

关键词：

Chlorine Compounds--Solutions - Electrolytes--Diffusion - Metals and Alloys--Corrosion - Surfaces--Etching;

D O I：

10.1149/1.2096231

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The mechanism controlling passivation of metal surface at tips of corrosion tunnels formed on aluminum by anodic etching in hot aqueous chloride solutions was studied. Theoretical considerations based on transport processes were used to rationalize SEM observations and potential measurements. In the mechanism proposed, electrolyte diffusion in the tunnels served to maintain the tips of all tunnels at the repassivation potential, which is the critical value below which active aluminum surfaces become passive.

引用

页码：2146 / 2157

页数：12

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