SIO PRODUCTION FROM SI(100) AND (111) SURFACES BY REACTION WITH O2 BEAMS

Desorption kinetics of SiO in the reaction of O2 with Si(100) and (111) surfaces were investigated at surface temperatures between 1000 and 1300 K by using a pulsed molecular beam technique. The gaseous SiO product was detected by a mass spectrometer above 1000 K. At temperatures lower than 1050 K, the SiO signal appeared with an induction time after the O2 beam irradiation onto the surface, which means that the desorption occurs via sequential steps. The rate constants for two steps were obtained by a computer simulation of the relaxation waveforms of the SiO signal. The values obtained are in the same range as those of D'Evelyn et al. However, they are one order of magnitude larger than those of Yu and Eldridge. The activation energies for the two steps are 2.8 and 2.4 eV for both Si(100) and (111) surfaces. No significant difference between the two kinds of surfaces was found from these values. However, many etch pits were observed on the Si(100) surface after the reaction, while no such etch pits were formed on the Si(111) surface. The planes of the etch pits formed on the (100) surfaces consisted mostly of the {111} facets.