APATITE COATED ON ORGANIC POLYMERS BY BIOMIMETIC PROCESS - IMPROVEMENT IN ADHESION TO SUBSTRATE BY HCL TREATMENT

被引:61
作者
TANAHASHI, M
YAO, T
KOKUBO, T
MINODA, M
MIYAMOTO, T
NAKAMURA, T
YAMAMURO, T
机构
[1] KYOTO UNIV,CHEM RES INST,UJI,KYOTO 611,JAPAN
[2] KYOTO UNIV,BIOMED ENGN RES CTR,SAKYO KU,KYOTO 606,JAPAN
[3] KYOTO UNIV,FAC MED,SAKYO KU,KYOTO 606,JAPAN
关键词
D O I
10.1007/BF00120299
中图分类号
R318 [生物医学工程];
学科分类号
0831 ;
摘要
A dense, uniform and highly biologically active bone-like apatite layer can be formed in arbitrary thickness on any kind and shape of solid substance by the following biomimetic method at normal temperature and pressure: first, a substrate is set in contact with particles of CaO-SiO2-based glass soaked in a simulated body fluid (SBF) with ion concentrations nearly equal to those of human blood plasma. Second, the substrate is soaked In another solution with ion concentrations 1.5 times those of SBF (1.5 SBF). In the present study, organic polymer substrates were treated with 1 M HCl solution, then subjected to the above mentioned biomimetic process. The induction periods for the apatite nucleation on polyethyleneterephthalate, polymethylmethacrylate, polyamide 6 and polyethersulfone substrates were reduced from 24 to 12 h with the HCl treatment. The adhesive strength of the formed apatite layer to the polyethyleneterephthalate, polymethylmethacrylate and polyamide 6 substrates were increased from 3.5 to 7.0 MPa from 1.1 to 2.8 MPa and from 0.6 to 3.1 MPa, respectively, with the HCl treatment. It is supposed that highly polar carboxyl group formed by the HCl hydrolysis reaction of ester group in polyethyleneterephthalate and polymethyl meth acrylate or amide group in polyamide 6 increased the affinity of the substrates with a silicate ion to decrease the induction period, and also increased the affinity of the substrate with the apatite to increase the adhesive strength. The apatite-organic polymer composites thus obtained are expected to be useful as bone-repairing materials as well as soft-tissue-repairing materials.
引用
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页码:319 / 326
页数:8
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