HIGH-SPEED CHIP-TO-CHIP OPTICAL INTERCONNECT

被引：8

作者：

JELLEY, KW

VALLIATH, GT

STAFFORD, JW

机构：

[1] Motorola Corporate Manufacturing Research Center, Schaumburg

来源：

IEEE PHOTONICS TECHNOLOGY LETTERS | 1992年 / 4卷 / 10期

关键词：

D O I：

10.1109/68.163764

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An intraboard chip-to-chip optical interconnect has been demonstrated as a compatible and potentially manufacturable last step in our conventional multichip module process. Chip-to-chip optical communication at 1 Gb / s NRZ was achieved using an edge emitting laser, a flip-chip p-i-n photodetector and a photodefined polymer optical waveguide.

引用

页码：1157 / 1159

页数：3

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