AR ION IMPLANT DAMAGE GETTERING OF GENERATION IMPURITIES IN SILICON EMPLOYING VOLTAGE RAMPING AND NITROGEN BACKSCATTERING

被引:8
作者
GOLJA, B
NASSIBIAN, AG
机构
来源
IEE JOURNAL ON SOLID-STATE AND ELECTRON DEVICES | 1979年 / 3卷 / 05期
关键词
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I
10.1049/ij-ssed.1979.0027
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The effects of Ar-ion implant gettering has been investigated using the linear voltage ramp applied to m. o. s. capacitors. A comparison is made with control (not implanted) samples and N** plus -ion Rutherford backscattering is used to examine the precipitation of generation impurities by the damaged layers. The gettering anneals were carried out over the temperature range 950-1100 degree C and for various times from 15 min to 120 min. It is shown that long gettering anneal times and high anneal temperatures both have a detrimental effect on minority-carrier lifetime.
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收藏
页码:127 / 132
页数:6
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