MICROSCOPY OF VOIDING DURING CREEP OF ALPHA-BRASS

被引:4
作者
ELLIOTT, IC
WILSHIRE, B
机构
[1] Department of Metallurgy and Materials Technology, University College, Swansea, Singleton Park
来源
JOURNAL OF MICROSCOPY-OXFORD | 1979年 / 116卷 / MAY期
关键词
D O I
10.1111/j.1365-2818.1979.tb00187.x
中图分类号
TH742 [显微镜];
学科分类号
摘要
Metallographic and fractographic methods have been used to study void formation during high‐temperature creep of alpha‐brass. The appearances of the creep fracture surfaces were found to differ markedly at high and low stress levels. Cavity development was therefore monitored using samples tested to various fractions of their creep lives which were then fractured in an intergranular manner by stress‐corrosion at room temperature. The different modes of void formation observed can be rationalized in terms of a model for cavity growth based on the movement of lattice dislocations in the plane of the grain boundary. 1979 Blackwell Science Ltd
引用
收藏
页码:39 / 45
页数:7
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