PASSIVE SELF-ALIGNED LOW-COST PACKAGING OF SEMICONDUCTOR-LASER ARRAYS ON SI MOTHERBOARD

A passive, self-aligned packaging technique for semiconductor laser arrays has been realized, Alignment trenches on the laser chip are used for self-alignment during flip-chip mounting on a silicon motherboard, The use of the etched Si sidewalls for alignment results in a self-positioning effect, reducing the necessary device placing precision, and allowing for large tolerances in the motherboard processing, resulting in low packaging costs, A module with four lasers and integrated monitor diodes has been pigtailed with multinode fibers. Optical mounting excess and differential losses between the channels are <0.5 dB.