SELF-ASSEMBLY - ITS USE IN AT-THE-SURFACE IMAGING SCHEMES FOR MICROSTRUCTURE FABRICATION IN RESIST FILMS

被引：7

作者：

TAYLOR, GN

HUTTON, RS

STEIN, SM

KATZ, HE

SCHILLING, ML

PUTVINSKI, TM

机构：

[1] AT and T Bell Laboratories, Murray Hill, NJ

来源：

MICROELECTRONIC ENGINEERING | 1994年 / 23卷 / 1-4期

关键词：

D O I：

10.1016/0167-9317(94)90150-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The self-assembly of refractory films on organic resist surfaces is used to provide an etching mask during the plasma transfer of patterns through underlying organic resists. Multilayer self-assembly using ZrOCl2 and H4P2O7 reagents affords multilayer structures that are selectively bound to oxidized resist layers. imaging is achieved using phenolic resin materials that are exposed to 193 nn radiation.

引用

页码：259 / 262

页数：4