ELECTROMECHANICAL BEHAVIOR OF A FULL COMPONENT (DIELECTRIC AND CU-NI CONSTANTAN ALLOY) FOR THIN-FILM STRAIN-GAUGE DEPOSITED UPON STEEL-SUBSTRATE

被引:9
作者
GOUAULT, J
HUBIN, M
RICHON, G
EUDELINE, B
机构
[1] UNIV ROUEN,ISHN,THERMOELECT COUCHES MINCES LAB,F-76130 MT ST AIGNAN,FRANCE
[2] INSCIR,F-76130 MONT ST AIGNAN,FRANCE
关键词
D O I
10.1016/0042-207X(77)90024-0
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:363 / 365
页数:3
相关论文
共 14 条
[1]  
COLOMBANI A, 1960, CR HEBD ACAD SCI, V250, P3946
[2]  
LECORDIER JC, 1974, THESIS U ROUEN
[3]  
LINDE JO, 1950, ARK FYS, V2, P99
[4]  
MACLACHLAN DFA, 1964, MICROELECTRON RELIAB, V3, P227
[5]  
MALSAN P, 1967, ONDE ELEC, P480
[6]  
MEIKSIN ZH, 1970, THIN SOLID FILMS, V4, P241
[7]  
OKIMURA JH, 1965, JAPAN J APPL PHYS, V4, P825
[8]   ELECTRICAL RESISTANCE-STRAIN CHARACTERISTICS OF THIN EVAPORATED METAL FILMS [J].
PARKER, RL ;
KRINSKY, A .
JOURNAL OF APPLIED PHYSICS, 1963, 34 (09) :2700-&
[9]  
PERINO PR, 1966, 21ST I SOC AM C EX N
[10]  
PRESTON DW, 1970, C INT COUCHES MINCES