EFFECT OF BOND ANGLE ON MIXED-MODE ADHESIVE FRACTURE

被引:17
作者
BASCOM, WD
OROSHNIK, J
机构
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D O I
10.1007/BF00553193
中图分类号
T [工业技术];
学科分类号
08 ;
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页码:1411 / 1418
页数:8
相关论文
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