THETA-JC CHARACTERIZATION OF CHIP PACKAGES - JUSTIFICATION, LIMITATIONS, AND FUTURE

被引：68

作者：

BARCOHEN, A ^{[1
]}

ELPERIN, T ^{[1
]}

ELIASI, R ^{[1
]}

机构：

[1] BEN GURION UNIV NEGEV,PEARLSTONE CTR AERONAUT ENGN,DEPT MECH ENGN,BEER SNEVA,ISRAEL

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1989年 / 12卷 / 04期

关键词：

D O I：

10.1109/33.49039

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：724 / 731

页数：8

共 10 条

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IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1988, 11 (04) :528-537

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FURKAY SS, 1988, IEEE T COMPON HYBR, V11, P521, DOI 10.1109/33.16693

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Holman J. P., 1976, HEAT TRANSF

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KORNBLUM Y, 1988, CREPPM882 CONTR DAT

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Kraus A.D., 1983, THERMAL ANAL CONTROL

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1982, IMSL LIBRARY REFEREN