COMPOSITE SOLDERS

被引:50
作者
MARSHALL, JL
CALDERON, J
SEES, J
LUCEY, G
HWANG, JS
机构
[1] INT ELECTR MAT CORP,CLEVELAND,OH 44139
[2] HARRY DIAMOND LABS,ADELPHI,MD 20783
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1991年 / 14卷 / 04期
关键词
D O I
10.1109/33.105119
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Development of "composite solders" has been performed, utilizing an intermetalic compound interspersed in a solder matrix. Principle work has been done on Cu6Sn5 intermetallic in 60/40 Sn/Pb (tin/lead). The composite solder was prepared by mixing powdered intermetallic in solder paste, with subsequent reflow. Formulations of 10-40% intermetallic (by weight) were investigated. Scanning electron microscope (SEM) characterization of cross sections of the composite solder was preferred over optical inspection, owing to the similar appearance of the Sn and Cu6Sn5 phases by the latter method. The mechanical properties of composite solder were examined and were found to be superior to those of standard tin/lead solder. Melting points of composite solder were the same as 60/40 tin/lead solder. Solder joints were readily prepared utilizing the composite solder and were forced to failure by thermocyclic fatigue; the mechanism of failure was the same as for 60/40 Sn/Pb solder, i.e., heterogeneous coarsening. Auger/ESCA analysis of the intermetallic was performed to ascertain the nature of the surface of this filler, and it was found to be enriched in tin.
引用
收藏
页码:698 / 702
页数:5
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